US Patent Issued to Taiwan Semiconductor Manufacturing on July 22 for "Dual-side power rail design and method of making same" (Taiwanese Inventors)

ALEXANDRIA, Va., July 23 -- United States Patent no. 12,368,078, issued on July 22, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Dual-side power rail design and method of making same" was invented by Chih-Chao Chou (Hsinchu, Taiwan), Yi-Hsun Chiu (Zhubei, Taiwan), Shang-Wen Chang (Jhubei, Taiwan), Ching-Wei Tsai (Hsinchu, Taiwan) and Chih-Hao Wang (Baoshan Township, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Methods of forming dual-side super power rails in semiconductor devices, semiconductor devices including the same, and methods of testing the semiconductor devices are disclosed. In an embodiment, a device includes a transistor structure; a front-side interco...