US Patent Issued to Taiwan Semiconductor Manufacturing on July 22 for "Double side integration semiconductor package and method of forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., July 23 -- United States Patent no. 12,368,142, issued on July 22, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Double side integration semiconductor package and method of forming the same" was invented by Monsen Liu (Hsinchu, Taiwan), Shang-Lun Tsai (Hsinchu, Taiwan), Shuo-Mao Chen (New Taipei, Taiwan) and Shin-Puu Jeng (Po-Shan Village, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An embodiment semiconductor device includes a first die package component, a second interposer electrically coupled to a first side of the first die package component, a third interposer having a voltage regulator circuit electrically coupled to a second side of the fir...