US Patent Issued to Taiwan Semiconductor Manufacturing on July 22 for "Diagonal vias in semiconductor structures" (Taiwanese Inventors)

ALEXANDRIA, Va., July 23 -- United States Patent no. 12,368,106, issued on July 22, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Diagonal vias in semiconductor structures" was invented by Shih-Wei Peng (Hsinchu, Taiwan), Chia-Tien Wu (Taichung, Taiwan) and Jiann-Tyng Tzeng (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor structure including a first conductive layer, a second conductive layer situated above the first conductive layer, and a via extending diagonally between the second conductive layer and the first conductive layer to electrically connect the first conductive layer to the second conductive layer."

The patent was filed on Dec. 6...