US Patent Issued to Taiwan Semiconductor Manufacturing on July 22 for "Device bonding apparatus and method of manufacturing a package using the apparatus" (Taiwanese Inventors)

ALEXANDRIA, Va., July 23 -- United States Patent no. 12,368,128, issued on July 22, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Device bonding apparatus and method of manufacturing a package using the apparatus" was invented by Yi-Jung Chen (Yilan, Taiwan), Tsung-Fu Tsai (Changhua, Taiwan) and Szu-Wei Lu (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "In an embodiment, a device bonding apparatus is provided. The device bonding apparatus includes a first process station configured to receive a wafer; a first bond head configured to carry a die to the wafer, wherein the first bonding head includes a first rigid body and a vacuum channel in the first rigid bod...