US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on July 22 for "Chip package structure with ring structure" (Taiwanese Inventors)

ALEXANDRIA, Va., July 23 -- United States Patent no. 12,368,080, issued on July 22, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Chip package structure with ring structure" was invented by Shu-Shen Yeh (Taoyuan, Taiwan), Po-Yao Lin (Zhudong Township, Hsinchu County, Taiwan), Shin-Puu Jeng (Hsinchu, Taiwan), Po-Chen Lai (Hsinchu County, Taiwan), Kuang-Chun Lee (New Taipei, Taiwan), Che-Chia Yang (Taipei, Taiwan), Chin-Hua Wang (New Taipei, Taiwan) and Yi Hang Lin (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A chip package structure is provided. The chip package structure includes a wiring substrate. The chip package structure includes a first chip stru...