ALEXANDRIA, Va., July 16 -- United States Patent no. 12,358,783, issued on July 15, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).
"Wire-bond damper for shock absorption" was invented by Tsung-Lin Hsieh (Hsinchu, Taiwan), Wei-Jhih Mao (Taipei, Taiwan), Shang-Ying Tsai (Pingzhen, Taiwan), Kuei-Sung Chang (Kaohsiung, Taiwan) and Chun-Wen Cheng (Zhubei, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "Various embodiments of the present disclosure are directed towards a microelectromechanical systems (MEMS) package comprising a wire-bond damper. A housing structure overlies a support substrate, and a MEMS structure is between the support substrate and the housing structure. T...