US Patent Issued to Taiwan Semiconductor Manufacturing on July 15 for "Three-dimensional integrated circuit" (Taiwanese Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,362,323, issued on July 15, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Three-dimensional integrated circuit" was invented by Jen-Yuan Chang (Hsinchu, Taiwan), Chia-Ping Lai (Hsinchu, Taiwan) and Chien-Chang Lee (Miaoli County, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A die stack includes: a first die including a first semiconductor substrate; a first redistribution layer (RDL) structure disposed on a front surface of the first die and electrically connected to the first semiconductor substrate; a second die bonded to the front surface of the first die and including a second semiconductor substrate; a thi...