US Patent Issued to Taiwan Semiconductor Manufacturing on July 15 for "Thermal module for a semiconductor package and methods of forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,362,258, issued on July 15, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Thermal module for a semiconductor package and methods of forming the same" was invented by Po-Yao Lin (Zhudong Township, Taiwan), Sheng-Liang Kuo (Hsinchu, Taiwan), Yu-Sheng Lin (Zhubei, Taiwan) and Kathy Yan (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A thermal module may include a cold plate including a cold plate base having a cold plate base protruding portion, and a cold plate cover on the cold plate base, and a heat pipe between the cold plate base and the cold plate cover, and including an upper heat pipe portion and a ...