US Patent Issued to Taiwan Semiconductor Manufacturing on July 15 for "Structure and formation method of semiconductor device with contact structures" (Taiwanese Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,363,947, issued on July 15, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Structure and formation method of semiconductor device with contact structures" was invented by Shih-Chieh Wu (Hsinchu, Taiwan), Pang-Chi Wu (Hsinchu, Taiwan), Wang-Jung Hsueh (New Taipei, Taiwan), Chao-Hsun Wang (Taoyuan, Taiwan), Kuo-Yi Chao (Hsinchu, Taiwan), Mei-Yun Wang (Hsin-Chu, Taiwan), Yi-Chun Chang (Hsinchu, Taiwan) and Yuan-Tien Tu (Puzih, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device structure and a method for forming a semiconductor device structure are provided. The semiconductor device structure includ...