ALEXANDRIA, Va., July 16 -- United States Patent no. 12,363,911, issued on July 15, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).
"Semiconductor structure and method for forming thereof" was invented by Yu-Wei Jiang (Hsinchu, Taiwan), Sheng-Chih Lai (Hsinchu County, Taiwan), Feng-Cheng Yang (Zhudong Township, Taiwan) and Chung-Te Lin (Tainan, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure provides a semiconductor structure. The semiconductor structure includes a substrate and a stacked structure disposed on the substrate. The stacked structure includes multiple alternately stacked insulating layers and gate members. A core structure is disposed i...