US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on July 15 for "Semiconductor structure and associated manufacturing method" (Taiwanese Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,363,972, issued on July 15, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Semiconductor structure and associated manufacturing method" was invented by Hsin-Li Cheng (Hsinchu County, Taiwan) and Yu-Chi Chang (Kaohsiung, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of manufacturing a semiconductor structure is disclosed. The method includes the following operations. An insulation region is formed in a substrate to define an active region in the substrate. A gate structure is formed across the active region. A source or drain region is formed in the active region and adjoins the insulation region. A r...