US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on July 15 for "Semiconductor structure, electronic device, and method of manufacturing semiconductor structure" (Taiwanese, American Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,364,017, issued on July 15, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Semiconductor structure, electronic device, and method of manufacturing semiconductor structure" was invented by I-Sheng Chen (Taipei, Taiwan), Yi-Jing Li (Hsinchu, Taiwan), Chia-Ming Hsu (Hualien County, Taiwan), Wan-Lin Tsai (Hsinchu, Taiwan) and Clement Hsingjen Wann (Carmel, N.Y.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor structure includes a first metal-dielectric-metal layer, a first dielectric layer, a first conductive layer, a second conductive layer, and a second dielectric layer. The first metal-dielectric-metal l...