US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on July 15 for "Semiconductor package with ball grid array connection having improved reliability" (Taiwanese Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,362,307, issued on July 15, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Semiconductor package with ball grid array connection having improved reliability" was invented by Yu-Sheng Lin (Zhubei, Taiwan), Chen-Nan Chiu (Hsinchu, Taiwan), Jyun-Lin Wu (Hsinchu, Taiwan) and Yao-Chun Chuang (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a substrate and at least one integrated circuit (IC) die. Substrate solder resist has substrate solder resist openings exposing substrate bonding pads of the bonding surface of the substrate, and die solder resist has aligned die solder re...