US Patent Issued to Taiwan Semiconductor Manufacturing on July 15 for "Semiconductor package having a semiconductor device bonded to a circuit substrate through a floated or grounded dummy conductor and method of manufacturing the same" (Taiwanese Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,362,276, issued on July 15, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Semiconductor package having a semiconductor device bonded to a circuit substrate through a floated or grounded dummy conductor and method of manufacturing the same" was invented by Feng-Cheng Hsu (New Taipei, Taiwan) and Shin-Puu Jeng (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device including an integrated circuit, a dielectric layer, a plurality of connecting terminals and at least one dummy conductor is provided. The integrated circuit has a plurality of connecting pads, and the dielectric layer is disposed...