ALEXANDRIA, Va., July 16 -- United States Patent no. 12,362,342, issued on July 15, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).
"Semiconductor package" was invented by Jie Chen (New Taipei, Taiwan), Hsien-Wei Chen (Hsinchu, Taiwan) and Ming-Fa Chen (Taichung, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a first die including an optical coupler, a second die disposed on the first die, and a transparent encapsulation material disposed on the first die. The second die includes a substrate and a transparent portion disposed within the substrate and optically coupled to the optical coupler. The transparent encapsulation material extends ...