ALEXANDRIA, Va., July 16 -- United States Patent no. 12,362,197, issued on July 15, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).
"Semiconductor die package with ring structure" was invented by Yu-Sheng Lin (Zhubei, Taiwan), Shu-Shen Yeh (Taoyuan, Taiwan), Chin-Hua Wang (New Taipei, Taiwan), Po-Yao Lin (Zhudong Township, Taiwan) and Shin-Puu Jeng (Hsinchu, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor die package is provided, including a package substrate, and two semiconductor dies disposed over the package substrate and arranged in a first direction. A ring structure is disposed over the package substrate and surrounds the semiconductor dies. The rin...