ALEXANDRIA, Va., July 16 -- United States Patent no. 12,362,317, issued on July 15, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).
"Semiconductor die dipping structure" was invented by Chi-Chun Peng (Hsinchu, Taiwan), Chih-Yuan Chiu (Zhudong Township, Taiwan), Min-Yu Wu (Hsinchu, Taiwan), Yi-Kai Tu (Hsinchu, Taiwan) and Cheng-Lung Wu (Zhunan Township, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A die dipping structure includes a plate including a first recessed portion having a first depth and filled with a first flux material. The plate further includes a second recessed portion, isolated from the first recessed portion, with a second depth and filled with a second ...