US Patent Issued to Taiwan Semiconductor Manufacturing on July 15 for "Semiconductor devices and methods of manufacturing" (Taiwanese Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,362,341, issued on July 15, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Semiconductor devices and methods of manufacturing" was invented by Chang-Yi Yang (Hsinchu, Taiwan), Po-Yao Chuang (Hsinchu, Taiwan) and Shin-Puu Jeng (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method includes forming a redistribution structure including metallization patterns; attaching a semiconductor device to a first side of the redistribution structure; encapsulating the semiconductor device with a first encapsulant; forming openings in the first encapsulant, the openings exposing a metallization pattern of the redistri...