ALEXANDRIA, Va., July 16 -- United States Patent no. 12,363,966, issued on July 15, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).
"Semiconductor devices and method of forming the same" was invented by Pei Yun Chung (Hsinchu, Taiwan), Chun-Chih Cheng (Changhua County, Taiwan), Ying-Liang Chuang (Hsinchu County, Taiwan), Ming-Hsi Yeh (Hsinchu, Taiwan) and Kuo-Bin Huang (Hsinchu County, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A method of forming a semiconductor device includes the following steps. A metal layer with at least one silicon-containing pattern therein is provided. A first wet etching process is performed by using a first etching solution, to clean a sur...