US Patent Issued to Taiwan Semiconductor Manufacturing on July 15 for "Semiconductor device and method of manufacturing the same" (Taiwanese Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,362,283, issued on July 15, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Semiconductor device and method of manufacturing the same" was invented by Ming-Hung Tseng (Miaoli County, Taiwan), Cheng-Chieh Hsieh (Tainan, Taiwan) and Hao-Yi Tsai (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes a stacked structure, first conductive terminals and second conductive terminals. The stacked structure includes a first semiconductor component having a first area and a second semiconductor component stacked on the first semiconductor component and having a second area smaller than the fi...