US Patent Issued to Taiwan Semiconductor Manufacturing on July 15 for "Semiconductor device and method of manufacture" (Taiwanese Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,362,261, issued on July 15, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Semiconductor device and method of manufacture" was invented by Chih-Chia Hu (Taipei, Taiwan), Sen-Bor Jan (Tainan, Taiwan), Hsien-Wei Chen (Hsinchu, Taiwan) and Ming-Fa Chen (Taichung, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device including a test pad contact and a method of manufacturing the semiconductor device are disclosed. In an embodiment, a semiconductor device may include a first metal feature and a second metal feature disposed in a single top metal layer over a substrate. A test pad may be formed over and ...