US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on July 15 for "Semiconductor device and method of manufacture" (Taiwanese Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,362,298, issued on July 15, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Semiconductor device and method of manufacture" was invented by Wei-Chun Liao (New Taipei, Taiwan), Guo-Zhou Huang (Kaohsiung, Taiwan), Huan-Kuan Su (Chiayi, Taiwan), Yu-Hong Pan (Tainan, Taiwan), Wen Han Hung (Tainan, Taiwan) and Ling-Sung Wang (Tainan, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device and method of manufacturing that includes a first etch stop layer and a second etch stop layer to prevent delamination and damage to underlying components. A first passivation layer and a second passivation layer are ...