US Patent Issued to Taiwan Semiconductor Manufacturing on July 15 for "Semiconductor device and method" (Taiwanese Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,362,291, issued on July 15, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Semiconductor device and method" was invented by Kuo-Chiang Ting (Hsinchu, Taiwan), Sung-Feng Yeh (Taipei, Taiwan), Ta Hao Sung (Hsinchu, Taiwan), Ming-Zhi Yang (Taichung, Taiwan) and Gao-Long Wu (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An embodiment includes a method including forming a first interconnect structure over a first substrate, the first interconnect structure including dielectric layers and metallization patterns therein. The method also includes forming a redistribution via and a redistribution pad over the fir...