US Patent Issued to Taiwan Semiconductor Manufacturing on July 15 for "Self-assembled dielectric on metal rie lines to increase reliability" (Taiwanese Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,362,231, issued on July 15, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Self-assembled dielectric on metal rie lines to increase reliability" was invented by Wei-Hao Liao (Taichung, Taiwan), Hsi-Wen Tien (Xinfeng Township, Taiwan), Chih Wei Lu (Hsinchu, Taiwan), Yu-Teng Dai (New Taipei, Taiwan), Hsin-Chieh Yao (Hsinchu, Taiwan) and Chung-Ju Lee (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Some embodiments of the present disclosure relate to a semiconductor structure including a first conductive wire disposed over a substrate. A dielectric liner is arranged along sidewalls and an upper surface of the...