US Patent Issued to Taiwan Semiconductor Manufacturing on July 15 for "Passivation layer for epitaxial semiconductor process" (Taiwanese Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,363,969, issued on July 15, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Passivation layer for epitaxial semiconductor process" was invented by Yin-Kai Liao (Taipei, Taiwan), Sin-Yi Jiang (Hsinchu, Taiwan), Hsiang-Lin Chen (Hsinchu, Taiwan), Yi-Shin Chu (Hsinchu, Taiwan), Po-Chun Liu (Hsinchu, Taiwan), Kuan-Chieh Huang (Hsinchu, Taiwan), Jyh-Ming Hung (Dacun Township, Taiwan) and Jen-Cheng Liu (Hsin-Chu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure relates to an integrated chip. The integrated chip includes a substrate having a first semiconductor material. A second semiconductor materia...