US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on July 15 for "Package structure with underfill" (Taiwanese Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,362,196, issued on July 15, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Package structure with underfill" was invented by Kuan-Yu Huang (Taipei, Taiwan), Sung-Hui Huang (Dongshan Township, Yilan County, Taiwan), Jui-Hsieh Lai (Taoyuan, Taiwan) and Shang-Yun Hou (Jubei, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A package structure is provided. The package structure includes a semiconductor die structure over a substrate and bonding structures between the semiconductor die and the substrate. The package structure also includes multiple solder elements over the substrate. The solder elements together surr...