US Patent Issued to Taiwan Semiconductor Manufacturing on July 15 for "Package structure and method of forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,362,274, issued on July 15, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Package structure and method of forming the same" was invented by Chih-Hsuan Tai (Taipei, Taiwan), Hao-Yi Tsai (Hsinchu, Taiwan), Tsung-Hsien Chiang (Hsinchu, Taiwan), Yu-Chih Huang (Hsinchu, Taiwan), Chia-Hung Liu (Hsinchu, Taiwan), Ban-Li Wu (Hsinchu, Taiwan), Ying-Cheng Tseng (Tainan, Taiwan) and Po-Chun Lin (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A package structure includes a thermal dissipation structure including a substrate, a first encapsulant laterally covering the substrate, a die disposed on the substrate and in...