US Patent Issued to Taiwan Semiconductor Manufacturing on July 15 for "Package structure and method of fabricating the same" (Taiwanese Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,362,270, issued on July 15, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Package structure and method of fabricating the same" was invented by Kris Lipu Chuang (Hsinchu, Taiwan), Tzu-Sung Huang (Tainan, Taiwan), Chih-Wei Lin (Hsinchu County, Taiwan), Yu-fu Chen (Hsinchu, Taiwan), Hsin-Yu Pan (Taipei, Taiwan) and Hao-Yi Tsai (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A package structure includes a first redistribution layer, a semiconductor die, and through vias. The first redistribution layer includes dielectric layers, first conductive patterns, and second conductive patterns. The dielectric layer...