US Patent Issued to Taiwan Semiconductor Manufacturing on July 15 for "Package assembly including package substrate with elongated solder resist opening and methods for forming the same" (Taiwanese, American Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,362,268, issued on July 15, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Package assembly including package substrate with elongated solder resist opening and methods for forming the same" was invented by Chin-Hua Wang (New Taipei, Taiwan), Shu-Shen Yeh (Taoyuan, Taiwan), Yu-Sheng Lin (Zhubei, Taiwan), Po-Yao Lin (Zhudong Township, Taiwan) and Shin-Puu Zeng (Po-Shan Village, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A package assembly includes a package substrate, a solder resist layer on the package substrate and including an elongated solder resist opening, and an interposer module on the package substrat...