US Patent Issued to Taiwan Semiconductor Manufacturing on July 15 for "Package assembly including a package lid having an inner foot and methods of making the same" (Taiwanese Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,362,245, issued on July 15, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Package assembly including a package lid having an inner foot and methods of making the same" was invented by Tsung-Fu Tsai (Changhua, Taiwan), Pu Wang (Hsinchu, Taiwan), Ying-Ching Shih (Hsinchu, Taiwan) and Szu-Wei Lu (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A package assembly may include a package substrate, a package lid attached to the package substrate and including a plate portion, an outer foot extending from the plate portion, and an inner foot extending from the plate portion inside the outer foot, and an adhesive ...