US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on July 15 for "Methods of performing chemical-mechanical polishing process in semiconductor devices" (Taiwanese Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,362,233, issued on July 15, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING Co. LTD. (Hsinchu, Taiwan).

"Methods of performing chemical-mechanical polishing process in semiconductor devices" was invented by Shih-Kang Fu (Taoyuan County, Taiwan), Ming-Han Lee (Taipei, Taiwan) and Shau-Lin Shue (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor structure includes a contact over a substrate, an interlayer dielectric (ILD) layer including a first region disposed directly above the contact and a second region disposed adjacent to the first region, first conductive features embedded in the first region and separated by a first ...