US Patent Issued to Taiwan Semiconductor Manufacturing on July 15 for "Methods of packaging semiconductor devices and packaged semiconductor devices" (Taiwanese Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,362,260, issued on July 15, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsin-Chu, Taiwan).

"Methods of packaging semiconductor devices and packaged semiconductor devices" was invented by Li-Hui Cheng (New Taipei, Taiwan), Po-Hao Tsai (Zhongli, Taiwan) and Jing-Cheng Lin (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Methods of packaging semiconductor devices and packaged semiconductor devices are disclosed. In some embodiments, a method of packaging a semiconductor device includes coupling through-vias to an insulating material, each of the through-vias having a first width. Dies are also coupled to the insulating mater...