US Patent Issued to Taiwan Semiconductor Manufacturing on July 15 for "Methods for spindle mechanism monitoring and maintenance in processing a semiconductor substrate" (Taiwanese Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,362,157, issued on July 15, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Methods for spindle mechanism monitoring and maintenance in processing a semiconductor substrate" was invented by Yu-Hsiang Cheng (Hsinchu, Taiwan) and Bo-Lin Wu (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure relates to methods of processing a semiconductor substrate in a processing chamber, such as a chemical vapor deposition chamber. The chemical vapor deposition chamber includes a spindle mechanism that cooperates with one or more carrier ring forks to move the semiconductor substrate from one station to ...