US Patent Issued to Taiwan Semiconductor Manufacturing on July 15 for "Methods for measuring a magnetic core layer profile in an integrated circuit" (Taiwanese Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,363,920, issued on July 15, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Methods for measuring a magnetic core layer profile in an integrated circuit" was invented by W. C. Chen (Hsinchu, Taiwan) and T. C. Lin (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An inductive structure may be manufactured with in-situ characterization of dimensions by forming a metal line on a top surface of a semiconductor die, forming a passivation dielectric layer over the metal line, measuring a height profile of a top surface of the passivation dielectric layer as a function of a lateral displacement, forming a magnetic ...