US Patent Issued to Taiwan Semiconductor Manufacturing on July 15 for "Method of fabricating package structure including a plurality of antenna patterns" (Taiwanese Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,362,275, issued on July 15, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Method of fabricating package structure including a plurality of antenna patterns" was invented by Sen-Kuei Hsu (Kaohsiung, Taiwan), Hsin-Yu Pan (Taipei, Taiwan) and Yi-Che Chiang (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A package structure includes a semiconductor die, an insulating encapsulant, a first redistribution layer, a second redistribution layer, a heat dissipation element and conductive balls. The insulating encapsulant is encapsulating the semiconductor die, and has a first surface and a second surface opposite t...