ALEXANDRIA, Va., July 16 -- United States Patent no. 12,362,160, issued on July 15, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).
"Method for forming layer" was invented by Hsin-Liang Chen (Hsinchu, Taiwan), Wen-Chih Wang (New Taipei, Taiwan), Chia-Hung Liao (Hsinchu, Taiwan), Cheng-Chieh Chen (Tainan, Taiwan), Yi-Ming Yeh (Hsinchu, Taiwan), Hung-Ting Lin (Hsinchu, Taiwan) and Yung-Yao Lee (Hsinchu County, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A method for forming a layer includes following operations. A workpiece is received in an apparatus for deposition. The apparatus for deposition includes a chamber, a pedestal disposed in the chamber to accommodate t...