ALEXANDRIA, Va., July 16 -- United States Patent no. 12,362,178, issued on July 15, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).
"Method for fabricating a chip package" was invented by Jie Chen (New Taipei, Taiwan), Hsien-Wei Chen (Hsinchu, Taiwan), Tzuan-Horng Liu (Taoyuan County, Taiwan) and Ying-Ju Chen (Yunlin County, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A first mask and a second mask are sequentially provided to perform a multi-step exposure and development processes. Through proper overlay design of the first mask and the second mask, conductive wirings having acceptable overlay offset are formed."
The patent was filed on Jan. 17, 2024, under Applicat...