US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on July 15 for "Method for etching etch layer" (Taiwanese Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,362,203, issued on July 15, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING Co. LTD. (Hsinchu, Taiwan).

"Method for etching etch layer" was invented by Manish Kumar Singh (Hsinchu, Taiwan), Bo-Wei Chou (Hsinchu, Taiwan), Jui-Ming Shih (Hsinchu, Taiwan), Wen-Yu Ku (Hsinchu, Taiwan), Ping-Jung Huang (Yunlin County, Taiwan) and Pi-Chun Yu (Taipei, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method includes rotating a wafer, dispensing a liquid from a center of the wafer to a peripheral edge of the wafer to control a temperature of the wafer, and etching an etch layer of the wafer with an etchant during or after dispensing the liquid. The liq...