US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on July 15 for "Method and apparatus for coating photo resist over a substrate" (Taiwanese Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,362,179, issued on July 15, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Method and apparatus for coating photo resist over a substrate" was invented by Tung-Hung Feng (Hsinchu, Taiwan), Hui-Chun Lee (Hsinchu, Taiwan), Sheng-Wen Jiang (Hsinchu, Taiwan) and Shih-Che Wang (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "In a method of coating a photo resist over a wafer, dispensing the photo resist from a nozzle over the wafer is started while rotating the wafer, and dispensing the photo resist is stopped while rotating the wafer. After starting and before stopping the dispensing the photo resist, a wa...