US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on July 15 for "Mechanisms for supplying process gas into wafer process apparatus" (Taiwanese Inventor)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,359,318, issued on July 15, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Mechanisms for supplying process gas into wafer process apparatus" was invented by Su-Horng Lin (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Embodiments of mechanisms for processing a semiconductor wafer are provided. A method for processing a wafer includes providing a wafer process apparatus. The wafer process apparatus includes a chamber and a stage positioned in the chamber for supporting the semiconductor wafer. The method also includes supplying a process gas to the semiconductor wafer via a discharged assembly that is...