US Patent Issued to Taiwan Semiconductor Manufacturing on July 15 for "Ion beam etching chamber with etching by-product redistributor" (Taiwanese Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,362,154, issued on July 15, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Ion beam etching chamber with etching by-product redistributor" was invented by Te-Hsien Hsieh (Kaohsiung, Taiwan) and Lee-Chuan Tseng (New Taipei, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "In some embodiments, the present disclosure relates to an etching apparatus. The etching apparatus includes a substrate holder disposed within a processing chamber and having a workpiece reception surface configured to hold a workpiece. A lower surface of the processing chamber has a first region that is directly below the workpiece reception surfac...