US Patent Issued to Taiwan Semiconductor Manufacturing on July 15 for "Interposer including stepped surfaces and methods of forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,362,246, issued on July 15, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Interposer including stepped surfaces and methods of forming the same" was invented by Yu-Sheng Lin (Zhubei, Taiwan), Hsin-Hsien Lee (Taoyuan County, Taiwan), Jyun-Lin Wu (Hsinchu, Taiwan) and Yao-Chun Chuang (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor structure includes an interposer having a first planar surface, a set of non-horizontal surfaces having a top periphery that are adjoined to a periphery of the first planar surface, and a frame-shaped surface adjoined to a bottom periphery of the set of non-horizo...