US Patent Issued to Taiwan Semiconductor Manufacturing on July 15 for "Heterogeneous dielectric bonding scheme" (Taiwanese Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,362,315, issued on July 15, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Heterogeneous dielectric bonding scheme" was invented by Chen-Hua Yu (Hsinchu, Taiwan), Wen-Chih Chiou (Zhunan Township, Taiwan), Ku-Feng Yang (Baoshan Township, Taiwan) and Ming-Tsu Chung (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method includes putting a first package component into contact with a second package component. The first package component comprises a first dielectric layer including a first dielectric material, and the first dielectric material is a silicon-oxide-based dielectric material. The second package c...