US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on July 15 for "Conductive structures and methods of fabrication thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,362,273, issued on July 15, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Conductive structures and methods of fabrication thereof" was invented by Jun-Nan Nian (Tainan, Taiwan), Yao-Hsiang Liang (Hsinchu, Taiwan), Jian-Shin Tsai (Tainan, Taiwan), Ming-Ching Chung (Tainan, Taiwan) and Chun-I Liao (Tainan, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Embodiments of the present disclosure relate to methods of fabricating conductive features to prevent metal extrusion. Particularly, the conductive feature includes a control layer to reduce grain size of a metal containing layer, thus obtaining a robust structu...