US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on July 15 for "Composition and method for polishing and integrated circuit" (Taiwanese, American Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,359,090, issued on July 15, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Composition and method for polishing and integrated circuit" was invented by Ji Cui (Bolingbrook, Ill.), Chi-Jen Liu (Taipei, Taiwan), Chih-Chieh Chang (Hsinchu County, Taiwan), Kao-Feng Liao (Hsinchu, Taiwan), Peng-Chung Jangjian (Hsinchu, Taiwan), Chun-Wei Hsu (Hsinchu, Taiwan), Ting-Hsun Chang (Kaohsiung, Taiwan), Liang-Guang Chen (Hsinchu, Taiwan), Kei-Wei Chen (Tainan, Taiwan) and Hui-Chi Huang (Hsinchu County, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A slurry composition, a polishing method and an integrated circuit are prov...