ALEXANDRIA, Va., July 16 -- United States Patent no. 12,362,201, issued on July 15, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).
"Bevel edge removal methods, tools, and systems" was invented by Hui-Chi Huang (Zhubei, Taiwan), Jeng-Chi Lin (Hsinchu, Taiwan), Pin-Chuan Su (Hsinchu, Taiwan), Chien-Ming Wang (Tainan, Taiwan) and Kei-Wei Chen (Tainan, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A tool and methods of removing films from bevel regions of wafers are disclosed. The bevel film removal tool includes an inner motor nested within an outer motor and a bevel brush secured to the outer motor. The bevel brush is adjustable radially outward to allow the wafer to be ...