US Patent Issued to Taiwan Semiconductor Manufacturing on July 15 for "Basin-shaped underbump plates and methods of forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,362,299, issued on July 15, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Basin-shaped underbump plates and methods of forming the same" was invented by Yen-Hao Chen (Taichung, Taiwan), Han-Hsiang Huang (Hsinchu, Taiwan), Yu-Sheng Lin (Zhubei, Taiwan), Chien-Sheng Chen (Hsinchu, Taiwan) and Shin-Puu Jeng (Po-Shan Village, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor structure includes a semiconductor die containing an array of first bonding structures. Each of the first bonding structures includes a first metal pad located within a dielectric material layer and a basin-shaped underbump metalliza...