US Patent Issued to Taiwan Semiconductor Manufacturing on July 15 for "Barrier free interface between BEOL interconnects" (Taiwanese Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,362,235, issued on July 15, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Barrier free interface between BEOL interconnects" was invented by Hsiu-Wen Hsueh (Taichung, Taiwan), Chii-Ping Chen (Hsinchu, Taiwan), Po-Hsiang Huang (Taipei, Taiwan) and Ya-Ching Tseng (Hsin-Chu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure relates a method of forming an integrated chip. The method includes forming a first interconnect within a first inter-level dielectric (ILD) layer over a substrate, and forming a second ILD layer over the first ILD layer. The second ILD layer is patterned to form an interconne...