US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on July 1 for "Wafer alignment apparatus and method for multi-cassette load port" (Taiwanese Inventors)

ALEXANDRIA, Va., July 3 -- United States Patent no. 12,347,704, issued on July 1, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Wafer alignment apparatus and method for multi-cassette load port" was invented by Cheng-Lung Wu (Zhunan, Taiwan), Chih-Hung Huang (Hsinchu, Taiwan), Yang-Ann Chu (Hsinchu, Taiwan) and Jiun-Rong Pai (Jhubei, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of a handling semiconductor wafers in a space of a semiconductor wafer processing facility includes: loading a cassette containing at least one semiconductor wafer into a storage buffer of a load port; measuring, from within the storage buffer, a position of a selected at least o...