US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on July 1 for "Using cumulative heat amount data to qualify hot plate used for post-exposure baking" (Taiwanese Inventors)

ALEXANDRIA, Va., July 3 -- United States Patent no. 12,347,682, issued on July 1, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING Co. LTD. (Hsinchu, Taiwan).

"Using cumulative heat amount data to qualify hot plate used for post-exposure baking" was invented by Chia-Cheng Chao (Hsinchu, Taiwan), Chung-Cheng Wang (Hsinchu, Taiwan) and Chun-Kuang Chen (Hsinchu County, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A test wafer is placed inside a baking module and is baked. Via one or more temperature sensors, a cumulative heat amount delivered to the test wafer during the baking is measured. The measured cumulative heat amount is compared with a predefined cumulative heat amount threshold. In response...